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ASRock H55M Pro motherboard review Print E-mail
Written by Hanners   
Thursday, 07 January 2010 15:00
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ASRock H55M Pro motherboard review
Intel H55 architecture, bundle
ASRock H55M Pro
Test setup, CPU and memory testing
I/O testing
Gaming, overclocking

ASRock H55M Pro motherboard review

This week has seen Intel finally bring the fruits of their Nehalem architecture to rest of their product line-up, effectively waving goodbye to the Core 2 era with the introduction of a new range of 32 nanometre Core i3 CPUs to the mainstream market.  Aside from CPU core count (all current Core i3 parts are dual-core offerings), the biggest change from previous Core i5 and Core i7 parts is the introduction of an Intel GPU integrated into the CPU package itself (and with the two devices directly connected via a QPI link), further progressing Intel's determination to pack as much technology as possible onto the CPU package itself after seeing both memory controller and PCI Express controller move in this direction previously.

Of course, with a GPU now bolted on to the CPU itself, a new motherboard chipset is required to offer up the required functionality and outputs for the integrated graphics chip to be utilised, which means that this week has also seen the introduction of the H55, H57 and X57 chipsets to Intel's line up.  It's the first of these three chipsets that we'll be focusing on here today, as we look at a motherboard courtesy of ASRock and their H55M Pro, which makes use of an H55 chipset in a micro-ATX form factor, but without skimping too hugely on other functionality.

Is this new motherboard and chipset worthy of consideration for anyone looking to build a Socket LGA 1156-based system with either a Core i3 or Core i5 CPU?  Let's put the H55M Pro through its paces to check it out.

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